d u a l n - c h a n n e l e n h a n c e m e n t m o d e m o s f e t c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . b . 3 - n o v . , 2 0 0 5 w w w . a n p e c . c o m . t w 1 a n p e c r e s e r v e s t h e r i g h t t o m a k e c h a n g e s t o i m p r o v e r e l i a b i l i t y o r m a n u f a c t u r a b i l i t y w i t h o u t n o t i c e , a n d a d v i s e c u s t o m e r s t o o b t a i n t h e l a t e s t v e r s i o n o f r e l e v a n t i n f o r m a t i o n t o v e r i f y b e f o r e p l a c i n g o r d e r s . a p m 7 3 1 3 k f e a t u r e s a p p l i c a t i o n s p i n d e s c r i p t i o n o r d e r i n g a n d m a r k i n g i n f o r m a t i o n n - c h a n n e l m o s f e t apm7313 handling code temp. range package code package code k : sop-8 operating junction temp. range c : -55 to 150 c handling code tu : tube tr : tape & reel lead free code l : lead free device blank : original device apm7313 k : apm7313 xxxxx xxxxx - date code lead free code 3 0 v / 6 a , r d s ( o n ) = 2 1 m w ( t y p . ) @ v g s = 1 0 v r d s ( o n ) = 2 7 m w ( t y p . ) @ v g s = 4 . 5 v s u p e r h i g h d e n s e c e l l d e s i g n r e l i a b l e a n d r u g g e d l e a d f r e e a v a i l a b l e ( r o h s c o m p l i a n t ) t o p v i e w o f s o p - 8 g1 s1 d1 d1 (8) (7) (2) (1) g2 s2 d2 d2 (6) (5) (4) (3) n o t e : a n p e c l e a d - f r e e p r o d u c t s c o n t a i n m o l d i n g c o m p o u n d s / d i e a t t a c h m a t e r i a l s a n d 1 0 0 % m a t t e i n p l a t e t e r m i n a t i o n f i n i s h ; w h i c h a r e f u l l y c o m p l i a n t w i t h r o h s a n d c o m p a t i b l e w i t h b o t h s n p b a n d l e a d - f r e e s o l d i e r i n g o p e r a t i o n s . a n p e c l e a d - f r e e p r o d u c t s m e e t o r e x c e e d t h e l e a d - f r e e r e q u i r e m e n t s o f i p c / j e d e c j s t d - 0 2 0 c f o r m s l c l a s s i f i c a t i o n a t l e a d - f r e e p e a k r e f l o w t e m p e r a t u r e . p o w e r m a n a g e m e n t i n n o t e b o o k c o m p u t e r , p o r t a b l e e q u i p m e n t a n d b a t t e r y p o w e r e d s y s t e m s
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . b . 3 - n o v . , 2 0 0 5 w w w . a n p e c . c o m . t w 2 a p m 7 3 1 3 k a b s o l u t e m a x i m u m r a t i n g s ( t a = 2 5 c u n l e s s o t h e r w i s e n o t e d ) e l e c t r i c a l c h a r a c t e r i s t i c s ( t a = 2 5 c u n l e s s o t h e r w i s e n o t e d ) symbol parameter rating unit v dss drain - source voltage 30 v gss gate - source voltage 20 v i d * continuous drain current 6 i dm * 300 m s pulsed drain current v gs =10v 24 a i s * diode continuous forward current 3 a t j maximum junction temperature 150 t stg storage temperature range - 55 to 150 c t a =25 c 2 p d * maximum power dissipation t a =100 c 0.8 w r q ja * thermal resistance - junction to ambient 62.5 c / w note : *surface mounted on 1in 2 pad area, t 10sec. apm 7313k symbol parameter test condition min. typ. max. unit static characteristics bv dss drain - source breakdown voltage v gs =0v, i ds =250 m a 30 v v ds = 20 v, v gs =0v 1 i dss zero gate voltage drain current t a =25 c 30 m a v gs(th) gate threshold voltage v ds =v gs , i ds =250 m a 1 1.5 2 v i gss gate leakage current v gs = 20 v, v ds =0v 100 na v gs = 10 v, i ds = 6 a 21 28 r ds(on) a drain - source on - state resistance v gs = 4.5 v, i ds = 2 a 27 42 m w v sd a diode forward voltage i sd = 2 a, v gs =0v 0.7 1.3 v gate charge characteristics b q g total gate charge 19 25 q gs gate - source charge 1.6 q gd gate - drain charge v ds = 15 v, v gs = 10 v, i d s = 6 a 3.6 nc
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . b . 3 - n o v . , 2 0 0 5 w w w . a n p e c . c o m . t w 3 a p m 7 3 1 3 k e l e c t r i c a l c h a r a c t e r i s t i c s ( c o n t . ) ( t a = 2 5 c u n l e s s o t h e r w i s e n o t e d ) apm 7313k symbol parameter test condition min. typ. max. unit dynamic characteristics b r g gate resistance v gs = 0 v,v ds =0v ,f=1mhz 2.1 w c iss input capacitance 835 c oss output capacitance 150 c rss reverse transfer capacitance v gs =0v, v ds =25v, f requency =1.0mhz 105 pf t d(on) turn - on delay time 7 13 t r turn - on rise time 8 15 t d(off) turn - off delay time 28 40 t f turn - off fall time v dd = 15 v, r l = 15 w , i d s = 1 a, v gen = 10v , r g = 6 w 6 9 ns notes: a : pulse test ; pulse width 3 00 m s, duty cyc le 2% . b : guaranteed by design, not subject to production testing .
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . b . 3 - n o v . , 2 0 0 5 w w w . a n p e c . c o m . t w 4 a p m 7 3 1 3 k t y p i c a l c h a r a c t e r i s t i c s i d - drain current (a) d r a i n c u r r e n t t j - j u n c t i o n t e m p e r a t u r e ( c ) s a f e o p e r a t i o n a r e a v d s - d r a i n - s o u r c e v o l t a g e ( v ) t h e r m a l t r a n s i e n t i m p e d a n c e s q u a r e w a v e p u l s e d u r a t i o n ( s e c ) p o w e r d i s s i p a t i o n p tot - power (w) t j - j u n c t i o n t e m p e r a t u r e ( c ) i d - drain current (a) normalized transient thermal resistance 0 20 40 60 80 100 120 140 160 0.0 0.5 1.0 1.5 2.0 2.5 t a =25 o c 0 20 40 60 80 100 120 140 160 0 2 4 6 8 t a =25 o c,v g =10v 1e-4 1e-3 0.01 0.1 1 10 30 1e-3 0.01 0.1 1 2 mounted on 1in 2 pad r q ja : 62.5 o c/w 0.01 0.02 0.05 0.1 0.2 single pulse duty = 0.5 0.01 0.1 1 10 100 0.01 0.1 1 10 100 1ms rds(on) limit 1s t a =25 o c 10ms 100ms dc
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . b . 3 - n o v . , 2 0 0 5 w w w . a n p e c . c o m . t w 5 a p m 7 3 1 3 k r ds(on) - on - resistance (m w ) d r a i n - s o u r c e o n r e s i s t a n c e i d - d r a i n c u r r e n t ( a ) t j - j u n c t i o n t e m p e r a t u r e ( c ) g a t e t h r e s h o l d v o l t a g e v d s - d r a i n - s o u r c e v o l t a g e ( v ) i d - drain current (a) o u t p u t c h a r a c t e r i s t i c s t r a n s f e r c h a r a c t e r i s t i c s v g s - g a t e - s o u r c e v o l t a g e ( v ) i d - drain current (a) normalized threshold voltage t y p i c a l c h a r a c t e r i s t i c s ( c o n t . ) 0 1 2 3 4 5 0 5 10 15 20 25 30 3.5v 2.5v 3v v gs = 4, 5, 6, 7, 8, 9, 10v 0 4 8 12 16 20 24 12 16 20 24 28 32 36 40 v gs = 10v v gs = 4.5v 0 1 2 3 4 5 0 5 10 15 20 25 30 t j =125 o c t j =25 o c t j =-55 o c -50 -25 0 25 50 75 100 125 150 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 i ds = 250 ma
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . b . 3 - n o v . , 2 0 0 5 w w w . a n p e c . c o m . t w 6 a p m 7 3 1 3 k v d s - d r a i n - s o u r c e v o l t a g e ( v ) d r a i n - s o u r c e o n r e s i s t a n c e normalized on resistance t j - j u n c t i o n t e m p e r a t u r e ( c ) c - capacitance (pf) v s d - s o u r c e - d r a i n v o l t a g e ( v ) s o u r c e - d r a i n d i o d e f o r w a r d i s - source current (a) c a p a c i t a n c e g a t e c h a r g e q g - g a t e c h a r g e ( n c ) v gs - gate - source voltage (v) t y p i c a l c h a r a c t e r i s t i c s ( c o n t . ) -50 -25 0 25 50 75 100 125 150 0.4 0.6 0.8 1.0 1.2 1.4 1.6 r on @t j =25 o c: 21m w v gs = 10v i ds = 6a 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0.1 1 10 30 t j =125 o c t j =25 o c 0 4 8 12 16 20 0 2 4 6 8 10 v ds = 15v i d = 6a 0 5 10 15 20 25 30 0 200 400 600 800 1000 1200 1400 frequency=1mhz crss coss ciss
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . b . 3 - n o v . , 2 0 0 5 w w w . a n p e c . c o m . t w 7 a p m 7 3 1 3 k p a c k a g i n g i n f o r m a t i o n millimeters inches dim min. max. min. max. a 1.35 1.75 0.053 0.069 a1 0.10 0.25 0.004 0.010 d 4.80 5.00 0.189 0.197 e 3.80 4.00 0.150 0.157 h 5.80 6.20 0.228 0.244 l 0.40 1.27 0.016 0.050 e1 0.33 0.51 0.013 0.020 e2 1.27bsc 0.50bsc f 1 8 8 h e e1 e2 0.015x45 d a a1 0.004max. 1 l s o p - 8 p i n ( r e f e r e n c e j e d e c r e g i s t r a t i o n m s - 0 1 2 )
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . b . 3 - n o v . , 2 0 0 5 w w w . a n p e c . c o m . t w 8 a p m 7 3 1 3 k terminal material solder - plated copper (solder material : 90/10 or 63/37 snpb) , 100%sn lead solderability meets eia specification rsi86 - 91, ansi/j - std - 002 category 3. t 25 c to peak tp ramp-up t l ramp-down ts preheat tsmax tsmin t l t p 25 temperature time critical zone t l to t p r e f l o w c o n d i t i o n ( i r / c o n v e c t i o n o r v p r r e f l o w ) c l a s s i f i c a t i o n r e f l o w p r o f i l e s p h y s i c a l s p e c i f i c a t i o n s profile feature sn - pb eutectic assembly pb - free assembly average ramp - up rate (t l to t p ) 3 c/second max. 3 c/second max. preheat - temperature min (tsmin) - temperature max (tsmax) - time (min to max) (ts) 100 c 150 c 60 - 120 seconds 150 c 200 c 60 - 180 seconds time maintained above: - temperature (t l ) - time (t l ) 183 c 60 - 150 seconds 217 c 60 - 150 seconds peak /classificatioon temperature (tp) see table 1 see table 2 time within 5 c of actual peak temperature (tp) 10 - 30 seconds 20 - 40 seconds ramp - down rate 6 c/se cond max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. notes: all temperatures refer to topside of the package .measured on the body surface.
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . b . 3 - n o v . , 2 0 0 5 w w w . a n p e c . c o m . t w 9 a p m 7 3 1 3 k c a r r i e r t a p e & r e e l d i m e n s i o n s t ao e w po p ko bo d1 d f p1 table 1. snpb entectic process ? package peak reflow temperature s package thickness volume mm 3 <350 volume mm 3 3 350 <2.5 mm 240 +0/ - 5 c 225 +0/ - 5 c 3 2.5 mm 225 +0/ - 5 c 225 +0/ - 5 c table 2. pb - free process ? package classification reflow temperatures package thickness volume mm 3 <350 volume mm 3 350 - 2000 volume mm 3 >2000 <1.6 mm 260 +0 c* 260 +0 c* 260 +0 c* 1.6 mm ? 2.5 mm 260 +0 c* 250 +0 c* 245 +0 c* 3 2.5 mm 250 +0 c* 245 +0 c* 245 +0 c* *tolerance: the device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means peak reflow temperature +0 c. for example 260 c+0 c) at the rated msl level. c l a s s i f i c a t i o n r e f l o w p r o f i l e s ( c o n t . ) test item method description solderability mil-std-883d-2003 245c,5 sec holt mil-std 883d-1005.7 1000 hrs bias @ 125c pct jesd-22-b, a102 168 hrs, 100% rh, 121c tst mil-std 883d-1011.9 -65c ~ 150c, 200 cycles r e l i a b i l i t y t e s t p r o g r a m
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . b . 3 - n o v . , 2 0 0 5 w w w . a n p e c . c o m . t w 1 0 a p m 7 3 1 3 k c u s t o m e r s e r v i c e c o v e r t a p e d i m e n s i o n s application carrier width cover tape width devices per reel sop- 8 12 9.3 2500 c a r r i e r t a p e & r e e l d i m e n s i o n s ( c o n t . ) a j b t2 t1 c application a b c j t1 t2 w p e 330 1 62 1.5 12.75 + 0.1 5 2 + 0.5 12.4 +0.2 2 0.2 12 + 0.3 - 0.1 8 0.1 1.75 0.1 f d d1 po p1 ao bo ko t sop - 8 5.5 0.1 1.55 0.1 1.55+ 0.25 4.0 0.1 2.0 0.1 6.4 0.1 5.2 0.1 2.1 0.1 0.3 0.013 (mm) anpec electronics corp. head office : no.6, dusing 1st road, sbip, hsin-chu, taiwan, r.o.c. tel : 886-3-5642000 fax : 886-3-5642050 taipei branch : 7f, no. 137, lane 235, pac chiao rd., hsin tien city, taipei hsien, taiwan, r. o. c. tel : 886-2-89191368 fax : 886-2-89191369
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